6-Layer RO4003C FR-4 Hybrid PCB with Depth-Controlled Slots for RF Applications
1.RO4003C Material Introduction
Rogers RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic material combining PTFE-like electrical performance with epoxy/glass manufacturability. Utilizing 1080/1674 glass fabrics, it maintains consistent electrical properties across configurations while costing significantly less than conventional microwave laminates.
Key characteristics include:
Excellent dimensional stability (CTE matches copper)
280°C Tg maintains stability through processing
No special through-hole treatments required
Non-brominated, not UL 94 V-0 rated
2.Material Features
Dielectric Constant: 3.38±0.05 @10GHz
Dissipation Factor: 0.0027 @10GHz, 0.0021 @2.5GHz
Thermal Conductivity: 0.71 W/m/K
CTE: X-11, Y-14, Z-46 ppm/°C
Moisture Absorption: 0.06%
3.Benefits
Ideal for multilayer constructions
FR-4 compatible processing
Cost-effective RF solution
High-volume production capable
4.PCB Construction Details
| Specification Category |
Details |
| Base Material | RO4003C / Tg170 FR-4 (Hybrid) |
| Layer Count | 6 Layers |
| Board Dimensions | 495mm × 345mm (±0.15mm) |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.8mm |
| Blind Vias | No |
| Finished Board Thickness | 6.8mm |
| Copper Weight | 1oz outer layers / 1oz inner layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Silkscreen | None (Top & Bottom) |
| Solder Mask | None (Top & Bottom) |
| Special Features | Depth-controlled slots (Top & Bottom layers) |
| Quality Assurance | 100% Electrical test before shipment |
5.PCB Stackup (6-Layer Rigid Structure)
| Layer | Material Type | Thickness | Notes |
|---|
| 1 | Copper | 35 μm | Outer layer |
| - | Tg170 FR-4 Core | 3.0 mm | |
| 2 | Copper | 35 μm | |
| - | Bonding Ply | 0.102 mm (4 mil) | |
| 3 | Copper | 35 μm | |
| - | Rogers RO4003C Core | 0.305 mm (12 mil) | High-frequency material |
| 4 | Copper | 35 μm | |
| - | Bonding Ply | 0.102 mm (4 mil) | |
| 5 | Copper | 35 μm | |
| - | Tg170 FR-4 Core | 3.0 mm | |
| 6 | Copper | 35 μm | Outer layer |
6.PCB Statistics:
Components: 132
Pads: 456 (271 thru-hole, 166 top SMT, 19 bottom SMT)
Vias: 131
Nets: 17
7.Typical Applications
Cellular base station antennas
RF identification tags
Automotive radar systems
Satellite LNBs
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support
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